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主要用于硅片、铌酸锂、光学玻璃、蓝宝石、阀片、机械密封件以及超硬材料的平面单面加压研磨抛光.
A型机床具有主动靠轮回转机构
B型机床压盘具有迥转系统
Mainly used for the flat surface pressure grinding and polishing of silicon wafer, lithium niobate, optical glass, sapphire, valve plate, mechanical seal, and super hard material.
A type machine tool has an active wheel revolving mechanism.
B type machine with rotary plate system.
